Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

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  • Patent
    Verbindungsstruktur
    ( 2002)
    Azdasht, G.
    ;
    Kasulke, P.
    ;
    Badrihafifekr, H.
    ;
    Weiss, S.
    ;
    Zakel, E.
    The components are of materials of different expansion coeffts., and at least one component is an electric power element. High melting material are used for connection structure, forming individual connection elements (29) between the contact faces (27,28) of the component elements (21,22). Preferably each connection element is made of a single material and directly coupled to the contact faces. Typically as a laminated structure. The connection elements may contain an intermediate layer of a soldering material for contacting the opposite contact faces. USE/ADVANTAGE - For electronic power elements, such as laser diodes etc. Reliable reduction of thermally induced stresses without impairing the component service life.
  • Patent
    Chipmodul sowie Verfahren zur Herstellung eines Chipmoduls
    ( 2002)
    Oppermann, H.H.
    ;
    Zakel, E.
    ;
    Azdasht, G.
    ;
    Kasulke, P.
    The chip module (20) has at least one chip (22) attached to a chip carrier (21) provided by a foil and a plastics carrier layer (23), providing a conductor path structure (24) with conductor paths (28) connected to corresponding contact pads (32) of the chip on the front side and provided with external contact regions (26) on the rear side, for connection to a circuit board substrate (31). The external contact regions are provided by openings in the carrier layer of the chip carrier at the rear side of the conductor paths, aligned with terminal pads (30) for the chip provided by the circuit board substrate. USE - For chip-scale package. ADVANTAGE - Simple manufacture of chip module with reduced number of individual steps.
  • Patent
    Verfahren zur Ausbildung einer raeumlichen Chipanordnung und raeumliche Chipanordung
    ( 1998)
    Oppermann, H.H.
    ;
    Azdasht, G.
    ;
    Kasulke, P.
    ;
    Zakel, E.