Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM

Filters
2 1
2
Reset filters

Settings
Now showing 1 - 2 of 2
  • Publication
    From packaging to system integration - the paradigm shift in microelectronics
    ( 2004)
    Wolf, M.J.
    ;
    Reichl, H.
    ;
    Adams, J.
    ;
    Aschenbrenner, R.
    Faced with the rapid development of IC technology the traditional packaging is merging into a complex system integration technique to satisfy the growing demand in terms of increased functionality, performance and miniaturization of electronic products. This requires the development of new packaging and system integration technologies using complex design tools along with new materials to realize complex systems in a package carrying multiple components such as silicon ICs, MEMS, sensors or optical devices. Some major aspects, challenges and requirements of system integration technologies are discussed which will be of special interest in the next years.
  • Publication
    Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
    ( 2002)
    Oppermann, H.
    ;
    Kalicki, R.
    ;
    Anhöck, S.
    ;
    Kallmayer, C.
    ;
    Klein, M.
    ;
    Aschenbrenner, R.
    ;
    Reichl, H.
    The choice of solder joint metallurgy is a key issue especially for the reliability of flip-chip assemblies. Besides the metallurgical systems already widely used and well understood, new materials are emerging as solderable under bump metallization (UBM). For single chip bumping Pd stud bumps form a solid core under the solder layer. These hard core solder bumps are an adequate solution if single dies are available only and the chosen assembly technology is flip chip soldering. The scope of this paper is to summarize the results from aging of lead/tin solder bumps on Palladium. The growth of intermetallic and its impact on the mechanical reliability are investigated.