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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Investigation and Modeling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE
Design and modeling of a novel piezoresistive microphone for aero acoustic measurements in laminar boundary layers using FEM and LEM