Title

7th Electronic System-Integration Technology Conference, ESTC 2018. Proceedings

Title Supplement

18th to 21st Sept. 2018, Dresden, Germany

Corporate Author

TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-5386-6814-6

978-1-5386-6813-9

978-1-5386-6815-3

Conference