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Title
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014
Title Supplement
Cannes, France, 1 - 4 April 2014
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Circuits Multi-Projets -CMP-, Grenoble
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2014
ISBN
978-2-35500-028-7
978-1-4799-3221-4