Title

Molecular modeling and multiscaling issues for electronic material applications. Vol.2

Title Supplement
Extended papers delivered at the IEEE EuroSimE Conference (also known as the International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems), at the Molecular Dynamics session between 2010 and 2013
Person Involved
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Cham
Publication Date
2015
ISBN
978-3-319-12861-0
978-3-319-12862-7
Conference