Title

3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Title Supplement

Tokyo, Japan; 22-23 May 2012

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2012

ISBN

978-1-4673-0743-7

978-1-4673-0742-0

Conference