Title

Fourth International Symposium on Semiconductor Wafer Bonding 1997. Proceedings. Science, technology, and applications

Person Involved

Corporate Author

Electrochemical Society -ECS-, Electronics Division

Publisher

Publishing Place

Pennington, NJ

Publication Date

1998

Series

Electrochemical Society. Proceedings; 97-36

ISBN

1-566-77189-7

Conference

International Symposium on Semiconductor Wafer Bonding 1997