Title

18th International Conference on Electronic Packaging Technology, ICEPT 2018

Title Supplement

Harbin, China, August 16-19, 2017

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5386-2972-7

978-1-5386-2971-0

978-1-5386-2973-4

Conference