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  4. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII
 
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Title

Reliability, packaging, testing, and characterization of MEMS/MOEMS VII

Title Supplement
21 - 22 January, 2008, San Jose, California, USA
Editor(s)
Hartzell, A.L.
Corporate Author
Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.
Publisher
SPIE  
Publishing Place
Bellingham, WA
Publication Date
2008
Series
Proceedings of SPIE; 6884
ISBN
978-0-8194-7059-1
Conference
Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS 2008  
Photonics West 2008  
MOEMS-MEMS Micro-Nano Fabrication Symposium 2008  
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