Title

Wafer bonding and thinning techniques for materials intergration

Title Supplement

April 16 - 20, 2001, San Francisco, California, USA

Corporate Author

Materials Research Society -MRS-

Publisher

Publishing Place

Warrendale, Pa.

Publication Date

2001

Series

Materials Research Society Symposium Proceedings; 681

ISSN

0272-9172

ISBN

1-558-99617-6

978-1-558-99617-5

Conference