Title

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems 2020. Proceedings

Title Supplement

October 27-29, 2020, Virtual

Corporate Author

American Society of Mechanical Engineers -ASME-

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division

Publisher

Publishing Place

New York/NY.

Publication Date

2020

ISBN

978-0-7918-8404-1

Conference