Title

Collection of papers presented at the 14th International Workshop on Thermal Investigation of ICs and Systems 2008

Title Supplement

Rome, Italy, 24 - 26 September 2008

Corporate Author

Circuits Multi-Projets -CMP-, Grenoble

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2008

ISBN

978-1-4244-3365-0

Conference