Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2025

Title Supplement

June 10-12, 2025, Copenhagen, Denmark

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publication Date

2025

ISBN

979-8-3315-2552-1

978-91-89971-83-7

DOI

10.23919/NordPac65171.2025

Conference

Nordic Conference on Microelectronics Packaging 2025

Acronym

NordPac

Language

English