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Title
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2007
Title Supplement
Imaps Poland 2007, London, 16-18.04.2007
Person Involved
Publisher
Publishing Place
Amsterdam
Publication Date
2008
Series
Microelectronics reliability; 48.2008, Nr.6
ISSN
0026-2714