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  4. Creep & fracture in high temperature components: design & life assessment issues. ECCC Creep Conference
 
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Title

Creep & fracture in high temperature components: design & life assessment issues. ECCC Creep Conference

Title Supplement
September 12 - 14, 2005, London
Person Involved
Publisher
DEStech Publications  
Publishing Place
Lancaster, Pa.
Publication Date
2005
ISBN
1-932078-49-5
Conference
Creep Conference 2005  
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