English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Hauptwerk
Creep & fracture in high temperature components: design & life assessment issues. ECCC Creep Conference
Information
Publications
Export
Statistics
Options
Title
Creep & fracture in high temperature components: design & life assessment issues. ECCC Creep Conference
Titel Supplements
September 12 - 14, 2005, London
Verlag
DEStech Publications
Verlagsort
Lancaster, Pa.
Datum
2005
ISBN
1-932078-49-5
Konferenz
Creep Conference 2005