Title

13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. Vol.1

Title Supplement

San Diego, California, USA, 30 May - 1 June 2012

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

New York, NY

Publication Date

2012

ISBN

978-1-4244-9533-7

978-1-4244-9531-3

978-1-4244-9532-0

Conference