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  4. 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009). Proceedings
 
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Title

2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009). Proceedings

Title Supplement
Beijing, China, 10 - 13 August 2009
Editor(s)
Bi, K.
Corporate Author
Zhongguo-Dianzi-Xuehui
China Electronic Packaging Society
Qinghua-Daxue, Beijing
Components, Packaging and Manufacturing Technology Society -CPMT-
Publisher
IEEE Press  
Publishing Place
Piscataway, NJ, USA
Publication Date
2009
ISBN
978-1-424-44658-2
978-1-4244-4659-9
Conference
International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) 2009  
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