Title

Design, Test, Integration and Packaging of MEMS/MOEMS

Title Supplement

Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS, 25 - 27 April 2007, Stresa, Lago Maggiore, Italy

Corporate Author

IEEE Components, Packaging, and Manufacturing Technology Society

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Grenoble

Publication Date

2007

ISBN

978-2-35500-000-3

Conference