Title

Semiconductor wafer bonding VII: Science, technology, and applications

Title Supplement
Proceedings of the international symposium ; Seventh International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications, held in April/May 2003 in Paris, France, as part of the 2003 spring meeting of the Electrochemical Society
Person Involved
Corporate Author
Electrochemical Society -ECS-, Electronics Division
Publisher
Publishing Place
Pennington, NJ
Publication Date
2003
Series
Electrochemical Society. Proceedings; 2003-19
ISBN
1-566-77402-0
Conference