Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2019. Proceedings

Title Supplement

11-13 June 2019, Copenhagen, Denmark

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2019

ISBN

978-91-519-2090-0

978-1-7281-2884-9

Conference