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Title
IEEE 9th VLSI Packaging Workshop of Japan, VPWJ 2008
Title Supplement
1 - 2 Dec. 2008, Kyoto
Corporate Author
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2008
ISBN
978-1-424-43498-5
978-1-4244-3497-8