Title

International Conference on Electronics Packaging and IMAPS All Asia Conference, ICEP-IAAC 2018

Title Supplement

Hotel Hanamizuki, Kuwana, Mie, Japan, April 17 (Tue)-21 (Sat), 2018

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-4-9902-1885-0

978-4-9902-1884-3

978-1-5386-4864-3

Conference