Title

SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM

Title Supplement

27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2011

ISBN

978-1-4577-0431-4

978-1-4577-0430-7

978-1-4577-0429-1

Conference