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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
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Title
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
Publisher
IEEE Press
Publishing Place
Piscataway, NJ, USA
Publication Date
2009
ISBN
978-1-4244-2127-5
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2008