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  4. Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008
 
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Title

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2008

Publisher
IEEE Press  
Publishing Place
Piscataway, NJ, USA
Publication Date
2009
ISBN
978-1-4244-2127-5
Conference
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) 2008  
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