Title

3rd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics, ESIME 2002. Proceedings

Title Supplement

15 - 17 April 2002, Cercle Républicain, Paris, France

Person Involved

Corporate Author

European Commission

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2002

ISBN

0-7803-9819-X

Conference