Title

Semiconductor Wafer Bonding 12. Science, Technology, and Applications

Title Supplement

Held during PRiME 2012, October 7 to 12, 2012, Honolulu, Hawaii

Person Involved

Corporate Author

Electrochemical Society -ECS-

Publisher

Publishing Place

Pennington, NJ

Publication Date

2012

Series

ECS transactions; 50.2012, Nr.7

ISSN

1938-5862

ISBN

978-1-62332-006-5

978-1-60768-355-1

Conference