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  4. 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
 
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Title

12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011

Title Supplement
8 - 11 Aug. 2011, Shanghai, China
Person Involved
Publisher
IEEE  
Publishing Place
Piscataway, NJ
Publication Date
2011
ISBN
978-1-457-71770-3
978-1-4577-1768-0
978-1-4577-1769-7
Conference
International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2011  
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