• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. DTIP of MEMS & MOEMS: Design, test, integration and packaging of MEMS/MOEMS 2003
 
  • Details
  • Publications
Options
Title

DTIP of MEMS & MOEMS: Design, test, integration and packaging of MEMS/MOEMS 2003

Title Supplement
Fifth Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Mandelieu-la-Napoule, Côte d'Azur, France, 5 - 7 May 2003
Person Involved
Corporate Author
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
IEEE Service Center  
Publishing Place
Piscataway, NJ
Publication Date
2003
ISBN
0-7803-7066-X
Conference
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) 2003  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024