Title

2nd IEEE International 3D System Integration Conference, 3DIC 2010

Title Supplement

Held at the "Fraunhofer Haus" in Munich in November 16-18, 2010

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2010

ISBN

978-1-4577-0526-7

1-4577-0526-5

978-1-4577-0527-4

Conference