Options
Title
4th International Conference on Thermal & Mechanical Simulation and Experiments in Microelectronics and Microsystems, ESIME 2003. Proceedings
Title Supplement
March 30 - April 2, 2003, Centre de Congrès d'Aix, Aix-en-Provence, France
Person Involved
Corporate Author
IEEE Components, Packaging, and Manufacturing Technology Society
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2003
ISBN
0-7803-7054-6