Title

4th IMPACT Conference & International 3D IC Conference 2009. Proceedings

Title Supplement
4th International Microsystems, Packaging, Assembly and Circuits Technology Conference SIPO International 3D IC Conference; October 21-23, 2009; Taipei Nangang Exhibition Hall; Taipei, Taiwan
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2009
ISBN
978-1-424-44341-3
978-1-4244-4342-0
Conference