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Title
International Conference on Electronic Materials and Packaging, EMAP 2008
Title Supplement
22 - 24 Oct. 2008, Taipei, Taiwan; in conjunction with the 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2008
ISBN
978-1-424-43621-7