Title

19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018

Title Supplement

15-18 April 2018, Toulouse, France

Advisor(s)

Editor(s)

Driel, W.D. van

University of Technology <Delft, Netherlands>

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2018

ISBN

978-1-5386-2358-9

978-1-5386-2359-6

978-1-5386-2360-2

Conference