Title

Advances in electronic materials and packaging 2001

Title Supplement

Proceedings of the 3rd International Symposium on Electronic Materials and Packaging 2001, November 19 - 22, 2001, Jeju Island, Korea

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2001

ISBN

0-7803-7157-7

Conference