Title

18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

Title Supplement

3-5 April 2017, Dresden

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Fraunhofer-Institut für Keramische Technologien und Systeme -IKTS-, Dresden

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5090-4344-6

978-1-5090-4343-9

978-1-5090-4345-3

Conference