Title

4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. Proceedings

Title Supplement

15-16 July 2014, Tokyo, Japan

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2014

ISBN

978-1-4799-5260-1

978-1-4799-5261-8

978-1-4799-5262-5

Conference