Title

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Title Supplement

Proceedings of the EuroSimE 2006, April 24-26, Como, Italy

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

New York, NY

Publication Date

2006

ISBN

1-4244-0275-1

978-1-4244-0275-5

Conference