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Title
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Title Supplement
Proceedings of the EuroSimE 2006, April 24-26, Como, Italy
Person Involved
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
New York, NY
Publication Date
2006
ISBN
1-4244-0275-1
978-1-4244-0275-5