Title

16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

Title Supplement

19-22 April 2015, Budapest, Hungary

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2015

ISBN

978-1-4799-9949-1

978-1-4799-9950-7

978-1-4799-9951-4

Conference