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Title
International Conference on Electronics Packaging, ICEP 2016
Title Supplement
April 20-22, 2016, Sapporo, Japan
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Japan Institute of Electronics Packaging -JIEP-
IEEE Components, Packaging, and Manufacturing Technology Society
International Microelectronics and Packaging Society -IMAPS-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2016
ISBN
978-4-904090-17-6
978-4-9040-9016-9
978-1-5090-1927-4