• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. 11th International Conference and Exhibition on Device Packaging 2015
 
  • Details
  • Publications
Options
Title

11th International Conference and Exhibition on Device Packaging 2015

Title Supplement
Fountain Hills, Arizona, USA, 16 - 19 March 2015
Corporate Author
International Microelectronics and Packaging Society
Publisher
Curran  
Publishing Place
Red Hook, NY
Publication Date
2015
ISBN
978-1-5108-0455-5
Conference
International Conference and Exhibition on Device Packaging (DPC) 2015  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024