Title

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2014. Proceedings
Titel Supplements
Yokohama, Japan, 9 - 11 September 2014
Institut
Japan Society of Applied Physics -JSAP-
IEEE Electron Devices Society
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2014
ISBN
978-1-4799-5288-5
978-1-4799-5289-2
978-1-4799-5287-8
Konferenz