Title

26th Electronics Packaging Technology Conference, EPTC 2024. Proceedings

Title Supplement

3 - 6 December 2024, Singapore

Editor(s)

Shin, Sunmi

Corporate Author

IEEE Electronics Packaging Society

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publication Date

2024

ISBN

979-8-3315-2201-8

979-8-3315-2200-1

DOI

10.1109/EPTC62800.2024

Conference

Electronics Packaging Technology Conference 2024

Acronym

EPTC

Language

English