Title

Design, Test, Integration and Packaging of MEMS / MOEMS. DTIP 2004. Proceedings

Title Supplement

Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Montreux, Switzerland, 12 - 14 May 2004

Person Involved

Corporate Author

Tima-Cmp Laboratory

IEEE Circuits and Systems Society

Publisher

Publishing Place

Grenoble

Publication Date

2004

ISBN

2-8481-3026-1

Conference