Title

22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Title Supplement

April 19-20-21-22, 2021, Virtual Conference

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2021

ISBN

978-1-6654-1374-9

978-1-6654-1373-2

Conference