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Title
Materials and hyperintegration challenges in next-generation interconnect techology
Title Supplement
Symposium M: Materials and Hyperintegration Challenges in Next-Generation Interconnect Technology. November 26 - 30, 2007, Boston
Publisher
Publishing Place
Red Hook, NY
Publication Date
2008
Series
Materials Research Society Symposium Proceedings; 1036
ISSN
0272-9172
ISBN
978-1-605-60833-4