Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022

Title Supplement
Gothenburg, Sweden, 12 - 14 June 2022
Corporate Author
IEEE Electronics Packaging Society  
International Microelectronics and Packaging Society -IMAPS-  
Institute of Electrical and Electronics Engineers -IEEE-  
Publisher
Publication Date
2022
ISBN
978-91-89711-39-6
978-1-6654-9177-8
Conference
Acronym
NordPac
Language
English