• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. 2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, SIITME 2013
 
  • Details
  • Publications
Options
Title

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging, SIITME 2013

Title Supplement
Proceedings of a meeting held 24-27 October 2013, Galati, Romania
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
IEEE  
Publishing Place
Piscataway, NJ
Publication Date
2013
ISBN
9781479915552
9781479915545
Conference
International Symposium for Design and Technology in Electronic Packaging (SIITME) 2013  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024