Title

14th International Congress Molded Interconnect Devices, MID 2021. Scientific Proceedings

Title Supplement

February 8th-11th, 2021, virtual event

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2021

ISBN

978-1-7281-7510-2

978-1-7281-7509-6

Conference