Title

8th International Conference on Electronics Packaging Technology, ICEPT 2007

Title Supplement

Shanghai, China, August 14th - 17th, 2007

Person Involved

Corporate Author

China Electronic Packaging Society

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2007

ISBN

1-424-41391-5

978-1-424-41391-1

1-4244-1392-3

Conference